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Copper Plate Products
17200 & 17510 Beryllium Copper Plate
Description

Beryllium Copper products have a high thermal conductivity rating relative to steel and aluminum, offering significant advantages in minimizing part distortion, dimensional control, and reducing cycle times in mold applications.

Typical Applications

Inserts for injection and blow molds
Electrical connectors
Precision screw machine parts
Welding elements (Resistance Welding)

Chemical Composition
Typical Analysis
Berylium Copper
Copper (Cu) :

Remainder

Lead (Pb)
-
Zinc (Zn)
-
Tin (Sn)
-
Silicon (Si)
.20
Aluminum (Al)
.20
Beryllium (Be)
1.80 - 2.00
Other : Nickel(Ni), Cobalt (Co)
.20 min
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